Metallization is the key step in the production of c-Si solar cells. The photogenerated carriers are led out of the cell by preparing metalized electrodes on the front and the back of the silicon wafer by screen printing and sintering of conductive paste. Solar cell paste is made up of conductive phase, binder and organic carrier, is the key material for metallization, and has an important influence on the cell’s photoelectric conversion efficiency and cost.
As the cost of photovoltaic power generation continues to decline, the era of photovoltaic grid parity is coming, and the demand for solar cells is growing rapidly. It is estimated that in 2021, the global new installed photovoltaic capacity will reach 158GW, bringing a huge market of tens of billions to the solar cell paste industry. Advanced front-side silver paste is helping PERC cells to achieve 23.5%+ mass production efficiency by adapting selective emitters and achieving ultra-fine line printing. At the same time, the rise of 182 and 210 large-size silicon wafer cells, it also puts forward higher requirements for screen printing and metallization processes.
Heterojunction (HJT) and TOPCon are the next generation of large-scale mass production cell technologies with the most development potential. The current silver paste consumption of these two cell technologies is much higher than that of PERC cells. How to continuously reduce the consumption of silver paste is the key to reduce the cost of HJT and TOPCon cell. Advanced paste and metallization technologies are expected to help HJT and TOPCon cells move towards 25%+ efficiency. International and domestic mainstream paste companies have launched paste products and metallization solutions suitable for HJT and TOPCon cells.
7th Solar Cell Paste and Metallization Forum 2021 will be held on March 25 in Changzhou, Jiangsu, China. The conference will discuss the PV industry outlook and paste market prospects, the development trend of solar cell technology and metallization processes, the research on the conductive mechanism and contact mechanism of silver paste metallization, the paste and metallization solutions for SE PERC cells to further improve efficiency and reduce costs, advanced paste and metallization processes that help HJT and TOPCon cells move towards 25%+ efficiency, technology paths of metallization cost reduction for HJT and TOPCon cells, screen printing and cell sintering technology and equipment, metallization process for perovskite tandem solar cell, etc.
1.Global and China PV industry outlook and solar cell paste market prospects
2.Development trend of solar cell technology and metallization processes
3.Research on the conductive mechanism and contact mechanism of silver paste metallization
4.Paste products and metallization processes that apply for large-size silicon wafers
5.Advanced paste and screen plate help SE PERC cell to further improve efficiency and reduce cost
6.Advanced silver paste helps HJT and TOPCon cells move towards 25%+ efficiency
7.MBB metallization process optimization and advanced series welding technology
8.Low-temperature silver paste and low-temperature metallization solutions for HJT cell
9.HJT cell ribbon tension and reliability optimization
10.High-efficiency copper grid line crystalline silicon HJT cell technology
11.The technical path of HJT and TOPCon cell to reduce silver paste consumption
12.High-efficiency N-type TOPCon backside silver paste supporting ultra-thin Poly layer
13.Low-temperature sintering process of the front and rear of TOPCon cell
14.Screen printing and cell sintering technology and equipment
15.Localization of key raw materials for photovoltaic paste: silver powder, aluminum powder, glass powder and organic carrier
16.Advantages and development prospects of double-sided simultaneous electroplating and metallization technology
17.Silver-clad copper technology to reduce the cost of solar cell metallization
18.Prospect of metallization process for perovskite tandem cell
17:00-20:00 Pre-conference Registration
12:30-14:00 Networking Lunch