Background

Background

AI growth is driving servers toward higher power density and broader liquid-cooling adoption. As rack power exceeds 100 kW, high-performance polyamides (HPPAs)—including PA12, reinforced PA66 and PPA—are becoming important materials for liquid-cooling components, offering low moisture absorption, hydrolysis and chemical resistance, and good dimensional stability.

Rising data rates are also increasing requirements for dielectric properties and heat resistance. Semi-aromatic high-temperature nylons such as PA6T, PA9T and PA10T, together with low-Dk/Df polyamide compounds, are increasingly used in high-speed connectors, optical-module components and precision server electronics.

Embodied intelligence is creating further opportunities for HPPAs. Carbon-fiber- and long-glass-fiber-reinforced polyamides can be used in robot frames, limb linkages and housings, balancing strength, stiffness, lightweighting and production efficiency.

The industry is evolving from base-resin supply toward an integrated value chain covering monomer synthesis, polymerization, compounding, molding and end-use validation. Advances in high-temperature nylons, long-chain polyamides, low-dielectric compounds, fiber reinforcement and precision molding require closer collaboration between material suppliers and end users. As domestic materials enter AI servers, liquid cooling, high-speed interconnects and humanoid robotics, consistent supply, application compatibility and long-term reliability will be key to high-end market adoption.

High-Performance Polyamide & AI Computing Materials Forum 2026 will take place in Suzhou, China, on Nov. 19–20, 2026. Organized by Asiachem Consulting, the forum will connect feedstock and monomer suppliers, resin producers, compounders, equipment suppliers, and companies in liquid cooling, high-speed interconnects, optical modules, AI servers and humanoid robotics.

Topics

Conference Topics

1. Global and China HPPA Markets: Supply, Demand and Localization

2. PA6T, PA9T and PA10T: Monomer Synthesis and Polymerization

3. PA11, PA12 and Copolyamides: Industrialization Progress

4. Bio-Based HPPAs: Technologies and Applications

5. High-Temperature Nylon Polymerization and Molecular-Weight Control

6. Hydrolysis-Resistant, Low-Extractables Polyamides for AI Liquid Cooling

7. Low-Moisture, Low-Dk/Df HPPAs: Design and Compounding

8. Flame-Retardant, Reinforced, Toughened and High-Flow Polyamides

9. Carbon-Fiber- and Long-Glass-Fiber-Reinforced Polyamides: Compounding and Molding

10. Polyamides for High-Power AI Server Liquid Cooling

11. High-Temperature Nylons for High-Speed Connectors and Optical Modules

12. HPPAs for Humanoid-Robot Lightweighting and Joint Drives

Program