Background

Background

The AI boom is driving surging demand for high-speed PCBs, copper clad laminates (CCLs), and specialty electronic resins. For M6–M9 and next-generation high-speed CCLs, material competition is shifting rapidly from conventional epoxy systems to low-dielectric, low-loss, and high-reliability resin platforms. Low-polarity materials—such as modified polyphenylene ether (PPO/PPE), hydrocarbon resins, and polybutadiene—have become essential matrix materials for AI servers, high-speed switches, and high-speed interconnect laminates.

For traditional PPO and hydrocarbon resin suppliers, AI CCLs open a critical window for upgrading from commodity chemicals to high-value electronic materials. Entering this market requires resolving synthesis challenges—such as molecular weight control, terminal functionalization, electronic-grade purity, and strict limits on metal ions and volatile content. It also demands collaborative development across crosslinkers, tougheners, low-Dk glass fabrics, quartz fabrics, copper foils, and CCL processing technologies.

Domestic suppliers are accelerating project planning and capacity expansion for electronic-grade PPO and high-end hydrocarbon resins. The competitive focus has evolved from basic production capability to stable mass production, validation, and reliable supply. Navigating multi-tiered qualification across CCL makers, PCB manufacturers, and end customers remains the key barrier to commercializing domestic high-end electronic resins.

PPO, Hydrocarbon Resins & AI CCL Forum 2026 will be held on Dec. 24–25, 2026, in Suzhou, China. Organized by AsiaChem Consulting, the event brings together resin and raw material suppliers, downstream CCL and PCB manufacturers, and AI end-use leaders. The event will focus on resin technologies, capacity planning, formulation, processing validation, and supply chain qualification. It aims to assist petrochemical and coal chemical companies in developing high-margin products, bridge supply chain gaps, and capture growth opportunities in AI high-speed interconnect materials and localization.

Topics

Key Topics

1. AI industry driving high-speed CCL demand & market outlook

2. PPO, hydrocarbon resins, and AI CCL applications

3. Resin rheology & processing adaptability in high-speed CCL

4. Electronic-grade PPO: Technical, projects, and localization opportunities

5. PPO raw materials, polymerization, molecular weight control

6. PPO and hydrocarbon resins in M6–M9 high-speed CCLs

7. Polybutadiene and low-loss hydrocarbon resin applications in AI CCLs

8. High-end hydrocarbon resin: Technology, capacity, & supply chain

9. Raw materials, molecular design & quality enhancement for hydrocarbon resins

10. Blending & compounding of PPO and hydrocarbon resins for high-speed CCL

11. Testing and evaluation of PPO, hydrocarbon resins, and AI high-speed CCLs

12. Supply chain: Certification across resins, CCLs, PCBs, and AI hardware

Program